Research Title |
Effects of Electrostatic Discharge Machine Model upon CIP-GMR and CPP-GMR Read Head |
Date of Distribution |
4 July 2010 |
Conference |
Title of the Conference |
The 25th International Technical Conference on Circuits/Systems, Computers and Communications |
Organiser |
ECTI Association, The Institute of Electronics Engineers of Korea, the institute of electronics, Information and Communication Engineers, National Telecommunication Commission, and Pattaya City |
Conference Place |
Ambassador Jomtien Hotel |
Province/State |
Pattaya |
Conference Date |
4 July 2010 |
To |
7 July 2010 |
Proceeding Paper |
Volume |
2010 |
Issue |
- |
Page |
756-759 |
Editors/edition/publisher |
|
Abstract |
The effects of ESD-MM upon CIP and CPP GMR were studied using finite element method (FEM). ESD-MM current was generated by using PSpice and used
as experimental input data for this study. FEM simulations revealed that the highest temperature occurs at AFM in both
structures; moreover the heat was conducted to a spacerlayer because of the high conductivity of copper comparing with other layers. In conclusion, CPP-GMR withstands ESD-MM hit more than the case of CIP GMR at the same ESD voltages. |
Author |
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Peer Review Status |
ไม่มีผู้ประเมินอิสระ |
Level of Conference |
นานาชาติ |
Type of Proceeding |
Abstract |
Type of Presentation |
Oral |
Part of thesis |
false |
Presentation awarding |
false |
Attach file |
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Citation |
0
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