2012 ©
             Publication
Journal Publication
Research Title Effects of Electrostatic Discharge Machine Model upon CIP-GMR and CPP-GMR Read Head 
Date of Distribution 4 July 2010 
Conference
     Title of the Conference The 25th International Technical Conference on Circuits/Systems, Computers and Communications 
     Organiser ECTI Association, The Institute of Electronics Engineers of Korea, the institute of electronics, Information and Communication Engineers, National Telecommunication Commission, and Pattaya City 
     Conference Place Ambassador Jomtien Hotel 
     Province/State Pattaya 
     Conference Date 4 July 2010 
     To 7 July 2010 
Proceeding Paper
     Volume 2010 
     Issue
     Page 756-759 
     Editors/edition/publisher  
     Abstract The effects of ESD-MM upon CIP and CPP GMR were studied using finite element method (FEM). ESD-MM current was generated by using PSpice and used as experimental input data for this study. FEM simulations revealed that the highest temperature occurs at AFM in both structures; moreover the heat was conducted to a spacerlayer because of the high conductivity of copper comparing with other layers. In conclusion, CPP-GMR withstands ESD-MM hit more than the case of CIP GMR at the same ESD voltages. 
Author
525040001-6 Miss KANUENGNIT MARONGMUED [Main Author]
Engineering Master's Degree
525040002-4 Miss SARUNYA PUAPAIROJ
Engineering Master's Degree
545040062-8 Miss SIRINAN WONGLAM
Engineering Master's Degree

Peer Review Status ไม่มีผู้ประเมินอิสระ 
Level of Conference นานาชาติ 
Type of Proceeding Abstract 
Type of Presentation Oral 
Part of thesis false 
Presentation awarding false 
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