2009-2015 ©
Journal Publication
Title of Article Coconut Shell Powder and Electrical Tree Inhibition of Solid Insulator 
Date of Acceptance 29 April 2018 
     Title of Journal Key Engineering Materials  
     Standard SCOPUS 
     Institute of Journal Trans Tech Publications, Switzerland 
     ISBN/ISSN 978-3-0357-1304-6 
     Volume 2018 
     Issue 775 
     Month September
     Year of Publication 2018 
     Page 89-93 
     Abstract Electrical tree phenomenon commonly occurred in solid insulator material resulting from the inconsistency of stresses during the manufacturing process. The treeing phenomenon will degrade the characteristic of insulator and may lead to breakdown. The use of filler in the manufacturing process in order to enhancing the insulation property is a popular approach. This paper presents the use of coconut shell powder (CSP) filler in epoxy resin for inhibition of electrical tree growth. The particle sizes of CSP varied from 62, 75 and 125 µm. The CSP is filled with the ratio of 0.1, 0.2, 0.4, 0.6, 0.8, 1.0, 2.0 and 3.0% by weight. We aim to observe the effects of varying the combination of CSP particle sizes and the ratio of epoxy resin for an inhibition of electrical tree growth. The electrical tree was tested by applying AC voltage of 15kV to the test sample and conducted for 360 minutes in this experiment. When the epoxy resin using CSP filler of 1% by weight is fixed for the particle size of 62, 75 and 125 µm, electrical tree length is at 1.24mm, 1.382 mm and 1.78 mm respectively. Whereas, when the particle size of CSP at 62 µm is fixed, a tree length is 1.98 mm and 1.24 mm for the ratio of 0.1 and 1% by weight respectively. Our study demonstrates that the epoxy resin using CSP filler at a ratio of 0.1% by weight can shorten length of electrical tree when compared with a ratio of 1.0% by weight. The electrical tree length was affected through the changes of permittivity by addition of CSP compound. 
     Keyword : Electrical Tree, Coconut Shell Powder, Treeing.  
585040022-4 Mr. THANYAKON SAITHANU [Main Author]
Engineering Master's Degree

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Level of Publication นานาชาติ 
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