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Publication
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| Research Title |
Effects of ESD and EMI on TMR Heads during Bonding Process of Gold Ball Bonding Machines |
| Date of Distribution |
12 January 2012 |
| Conference |
| Title of the Conference |
SI International 2011 |
| Organiser |
Kyoto University |
| Conference Place |
Kyoto University, Japan |
| Province/State |
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| Conference Date |
12 January 2012 |
| To |
12 January 2012 |
| Proceeding Paper |
| Volume |
2011 |
| Issue |
- |
| Page |
419-423 |
| Editors/edition/publisher |
IEEE |
| Abstract |
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| Author |
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| Peer Review Status |
ไม่มีผู้ประเมินอิสระ |
| Level of Conference |
นานาชาติ |
| Type of Proceeding |
Full paper |
| Type of Presentation |
Oral |
| Part of thesis |
true |
| ใช้สำหรับสำเร็จการศึกษา |
ไม่เป็น |
| Presentation awarding |
false |
| Attach file |
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| Citation |
0
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Journal Publication
ไทย